Project Description

Copper Nickel Silicon Alloy C7025

  • Standard

JIS

DIN

EN

ASTM/UNS/
CDA

GB/T

C7025

CuNi3Si

CuNi3Si

C70250

/

  • Description

C70250 is a high performance alloy that combines strength, conductivity, formability and stress relaxation resistance into a unique set of properties. C70250 has the qualities of some of the Beryllium Coppers without containing any Beryllium. The alloy is a thermally aged material. It achieves it’s properties by combinations of cold work and heat treatments, all of which is done at the mill. The alloy’s high strength and conductivity combined with its formability and stress relaxation properties make C70250 an excellent electronic alloy, particularly in high temperature environments.

  • Mechanical properties

Density (g/cm3)

8.82

Coefficient of thermal expansion
10-6/℃ 20/℃ ~100/℃

17.6

Electrical conductivility IACS%(20℃)

40

Modulus of elasticity (KN/mm2)

130

Thermal conductivity W/(m*K)

190

  • Good points

1.High strength and good stress relaxation resistance.

2.Excellent spring properties, good corrosion resistance in industrial atmospheres and is resistant against stress corrosion cracking.

  • Application

Contact Springs, Lead Frames, Electronic Connectors, Automotive Electronic, Connectors, Automotive Electrical Connectors

  • Available Sizes

Thickness:0.1mm-2.0mm

Width:1.0-300mm

  • Typical size

Thickness:0.25mm,0.30mm

Width:10-300mm

  • Lead time

7-35days

Please contact us for more details about product information, price, packing and shipping.