Aluminum oxide dispersion-strengthened copper C15760
JIS | DIN | EN | ASTM/UNS/ | GB/T |
/ | / | / | C15760 | / |
C15760 mix aluminum oxide (ceramic) particles in a copper matrix. The addition of small amounts of aluminum oxide has a minuscule effect on the good performance of copper alloys at room temperature, slightly decreasing their thermal and electrical conductivity. However, it greatly increases the copper alloy’s resistance to thermal softening and enhances mechanical strength at elevated temperature. This is particularly true when the material is fabricated using a cold heading process.
Density (g/cm3) | 8.81 | Coefficient of thermal expansion | 9.2 | ||
Electrical conductivility IACS% | 78 | Modulus of elasticity (KN/mm2) | 170 | ||
Thermal conductivity W/(m*K) | 186 |