Project Description

Oxygen free low phosphorus copper C10300A

  • Standard

JIS

DIN

EN

ASTM/UNS/
CDA

GB/T

C1030

SE-Cu57

Cu-HCP

C10300A

/

  • Description

Cu-HCP is a deoxidized, oxygen-free copper with a low residual phosphorus content. It combines very good formability, weldability and brazability with high electrical conductivity (min. 98% IACS).

  • Mechanical properties

Density (g/cm3)

8.94

Coefficient of thermal expansion
10-6/℃ 20/℃ ~100/℃

17.7

Electrical conductivility IACS%(20℃)

98

Modulus of elasticity (KN/mm2)

127

Thermal conductivity W/(m*K)

385

  • Good points

Good formability, weldability and brazability with high electrical conductivity.

  • Application

Telecommunication cables, terminals, clad products, busbars, base plates for power modules, electrical conductors, pressure vessels.

  • Available Sizes

Thickness:0.1mm-2.0mm

Width:1.0-300mm

  • Typical size

Thickness:0.1mm,0.2mm,0.30mm

Width:10-300mm

  • Lead time

7-35days

Please contact us for more details about product information, price, packing and shipping.