Bimetallic Alloy 5J20110 (HITACHI: BR-1)
JIS C2530 | DIN 1715 | EN | ASTM B388 | GB/T4461 |
TM1.200R110 (HITACHI: BR-1) | TB20110 | / | TM2 （EMS:P675R） | 5J20110 |
Thermal bimetal is a composite material that is firmly bonded by two or more layers of alloys with different linear expansion coefficients. The alloy layer with a larger expansion coefficient is called the active layer, and the alloy layer with a smaller expansion coefficient is called the passive layer. An intermediate layer can be added between the active layer and the passive layer to adjust the resistance. When the ambient temperature changes,Due to the different expansion coefficients of the active layer and the passive layer, bending or rotation occurs.
Density (g/cm3) | 7.76 | Electrical Resistivity at 25℃ | 1.12 μ Ω.m | ||
Flexivity(Specific Curvature) | 39.0±4% x 10-6 (mm/mm)/°C | Max. Sensitivity Temperature Range | -20 to 200℃ | ||
Useful Deflection Temperature Range | -70 to 250 ℃ | Max. Recommended Temperature | 350℃ | ||