Types of electroplating layers corresponding to different quality requirements.

How are tin whiskers produced?

The occurrence of tin whiskers is actually a kind of “stress release” behavior.

Many factors drive tin whisker growth, of which compressive stress is the more common growth mechanism model.
The compressive stress comes from: the substrate itself, the electrodeposited bottom layer, and the electrodeposited tin.
Electrodeposited tin itself usually contains slight tensile stresses, while stress relief of the substrate induces compressive stresses.

Why does reflow tin plating have good anti-whisker characteristics?

Pure tin coating surface reflow (Reflow Tin) treatment; after high-temperature reflow melting tin, it can reduce the stress between the coatings, form reliable solder joints and stable tin coating, so as to achieve the purpose of inhibiting the growth of tin whiskers.