Project Description
Copper Nickel Silicon Alloy C7035
JIS | DIN | EN | ASTM/UNS/ | GB/T |
C7035 | CuNi1Co1Si | / | C70350 | / |
C70350 is a high performance alloy that combines strength, conductivity, formability and stress relaxation resistance into a unique set of properties.
Density (g/cm3) | 8.82 | Coefficient of thermal expansion | 17.6 | ||
Electrical conductivility IACS%(20℃) | 45-50 | Modulus of elasticity (KN/mm2) | 120 | ||
Thermal conductivity W/(m*K) | 200 |
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Very good in bend formability and high electrical conductivity for connectors. This unique combination of properties lends the alloy to uses in a vast array of applications including CPU sockets, automotive and electrical connectors and various springs.
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Particularly suitable for replacement of Beryllium Copper, with eco-friendliness and cost competitiveness for its chemical composition.
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Excellent bend formability though its strength is higher than C7025.
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Very good stress relaxation and heat resistance properties at elevated temperature as well as C7025.
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No heat treatment required for hardening.