Project Description
Copper Nickel Silicon Alloy C7025
JIS | DIN | EN | ASTM/UNS/ | GB/T |
C7025 | CuNi3Si | CuNi3Si | C70250 | / |
C70250 is a high performance alloy that combines strength, conductivity, formability and stress relaxation resistance into a unique set of properties. C70250 has the qualities of some of the Beryllium Coppers without containing any Beryllium. The alloy is a thermally aged material. It achieves it’s properties by combinations of cold work and heat treatments, all of which is done at the mill. The alloy’s high strength and conductivity combined with its formability and stress relaxation properties make C70250 an excellent electronic alloy, particularly in high temperature environments.
Density (g/cm3) | 8.82 | Coefficient of thermal expansion | 17.6 | ||
Electrical conductivility IACS%(20℃) | 40 | Modulus of elasticity (KN/mm2) | 130 | ||
Thermal conductivity W/(m*K) | 190 |