Project Description
Deoxidized Low Phosphorous Copper C12200
JIS | DIN | EN | ASTM/UNS/ | GB/T |
C1220 | SF-Cu | Cu-DHP | C12200 | / |
C12200 with a nominal composition of 99.9 % minimum copper and 0.02 % phosphorus is the most widely used copper for tube and pipe but also finds widespread use for sheet and strip items. Cu-DHP exhibits better ductility than Cu-ETP and is adaptable for progressive drawing operations requiring few or no intermediate anneals. A major advantage of Cu-DHP is the freedom from hydrogen embrittlement susceptibility in reducing atmospheres. This advantage is utilized in the cladding of steel and subsequent reducing atmosphere anneals without incurring the embrittlement, which occurs when cladding with Cu-ETP. The electrical and thermal conductivity are lower when compared with Cu-ETP but adequate for many applications as exemplified by a major use of strip to produce air conditioning and refrigeration tubing by gas shielding arc welding techniques.
Density (g/cm3) | 8.94 | Coefficient of thermal expansion | 17.6 | ||
Electrical conductivility IACS%(20℃) | 79 | Modulus of elasticity (KN/mm2) | 132 | ||
Thermal conductivity W/(m*K) | 340 |